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Evaluation of Different Brands of Led Curing Devices for Bonding Metallic Orthodontic Brackets

Ansari S,Gupta G,Gautam R,Kalia A*

The aim of this study was to evaluate the effect of different light curing devices i.e. Light emitting diodes (LED) for bonding orthodontic brackets, using the shear bond strength and assess the adhesive remnant index (ARI). 75premolars received brackets bonded with transbond XT. The samples were divided into 5 groups consisting of 15 brackets in each group according to light curing procedures: HL – HalogenDensply (Control),I – Ivoclar(Ledition), M - 3M (Elipar), W - (Woodpecker) and A - (Allure). Light curing was performed for 40 sec. Universal testing machine at a crosshead speed of 3mm/min was used to evaluate the shear bond strength. ANOVA and Tukey’s test was used to analyse the data. Stereoscopic magnifying glass was used to assess the ARI scores. Shear bond strength means in MPA and standard deviations were 14.8 (2.2), 18.3 (4.9), 18.2 (6.4), 16.2 (5.6) and 15.8 (6.1) forHL, I, M, W and A respectively. I showed the maximum shear bond strength mean value. No statically significantly difference was observed for the ARI scores among the groups. In conclusion, IvoclarLedition and 3M Elipar LED’s showed the highest values of bracket adhesive strength.